Precision Molecular Engineering
SC6900 Sintered Silver — Pressureless, Power Module, High-Temp, High-Strength, Low Resistivity, Anti-Aging
Sintered silver series. Pressured/pressureless, full/partial sinter variants. Ultra-low resistivity, high bond strength, multi-aging test pass. Up to 280 W/m·K thermal. 1000 thermal cycles (-40 to 125 °C): 98% shear retention; damp-heat storage 1000 h (85 °C / 85% RH): 90% shear retention.
Advanced semiconductors, power modules and advanced packaging — bonding, interconnect, thermal and electrical conduction.
- Shear Strength
- 26 MPa
- Temperature Range
- -45 °C–280 °C
- Aging Resistance
- 85/85 1000 h
- Thermal Conductivity
- 220–280 W/m·K
SCITEO Rigorous Standards: Qualified under GJB 150 environmental reliability testing by Zhenhua, CETC, and CAC, delivering mission-critical reliability.
Engineered as high-reliability domestic qualified alternatives for semiconductor and defense manufacturing clusters across Shanghai Zhangjiang, Xi'an, Chengdu, and Wuxi.
Specifications Don't Match Your Operating Conditions?
This page displays only the baseline product series. Within SCITEO's undisclosed database, we maintain extensive formulations engineered for extreme environments. Contact us directly — our application experts will deliver a precise match.
High Reliability Scenarios
Core positioning and partial application demonstration of this product under complex operating cycles.
IGBT Die Attach
Power Module Bonding
Semiconductor Chip Bonding
Application Engineer FAQ
SCITEO's structured answers regarding physical properties, industry standards, operating procedures, and technical specifications.
Pressured vs. pressureless sintering?
Pressure-assisted sintering applies 5–40 MPa and lowers the sintering temperature, improving porosity, conduction, and shear strength; it is more demanding, whereas pressureless sintering offers broader compatibility.
Anti-aging performance?
SC6900 passes multiple 1000-hour-class aging protocols: after 260 °C storage, -45 to 155 °C thermal cycling, and 85/85 damp-heat exposure, both shear strength and the thermal conduction path remain stable with no measurable drift.
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SC6616 Die-Attach Conductive Silver — High-Strength, High-Tg, Low Resistivity, Thermal-Cure Epoxy
SC66 series single-component conductive silver epoxy. High die-shear strength, high-Tg for aging resistance, chip-grade. Multiple thermal conductivity grades, ultra-low resistivity, low-CTE. Dispensable & printable. 2.6–5 GPa multi-grade tensile modulus. 500 thermal cycles (-40 to 125 °C): 84% shear retention; damp-heat 1000 h (85 °C / 85% RH): 70% shear retention.
SC618 500 °C Conductive Adhesive — Single-Component, Heat-Cure, High-Strength, Low-Resistance Bonding
SC618 500 °C conductive. Single-component, 30 MPa bond, zero outgassing at temperature. Bonds metals, ceramics, glass, quartz and SiC; low water absorption. Acid/alkali/solvent resistant. RT storage, no cold chain. Heat aging 168 h at 500 °C: 70% shear-strength retention.
SC616 1000 °C Conductive Silver — Two-Component, Heat-Cure, Low Resistivity, Anti-Aging, High-Strength
1000 °C conductive silver. Two-component, heat-cure. Anti-aging, thermal-cycle resistant, 0.00004 Ω·cm. Bonds ceramics, glass, metals and SiC. Acid/alkali/solvent resistant. Heat aging 360 h at 500 °C: 90% shear retention.